CV

Contact Information

Name Donglin Yang
Professional Title MPhil Student
Email ydlin718@gmail.com

Experience

  • 2025 - present

    Shenzhen, China

    Research Intern
    KLING Team, Kuaishou Technology
  • 2023 - 2024

    Shanghai, China

    Research Intern
    Shanghai Artificial Intelligence Laboratory

Education

  • 2024 - present

    Hong Kong, China

    MPhil
    Department of Electrical and Electronic Engineering, The University of Hong Kong
    • Advisor: Prof. Xiaojuan Qi
    • Research: Deep Generative Models
  • 2023 - 2024

    Vancouver, Canada

    PhD
    Department of Electrical and Computer Engineering, University of British Columbia
    • Advisor: Prof. Renjie Liao
    • Remote due to Canadian visa issues
  • 2022 - 2023

    Evanston, USA

    PhD
    Department of Computer Science, Northwestern University
    • Advisor: Prof. Han Liu
    • Remote due to U.S. visa issues
  • 2018 - 2022

    Beijing, China

    B.Eng
    Department of Electronic Engineering, Tsinghua University

Awards

  • 2025
    AISTATS 2025 Best Reviewer Award
    AISTATS 2025
  • 2023
    The Four Year Fellowship (4YF)
    University of British Columbia
  • 2022
    Northwestern Graduate School Fellowship
    Northwestern University
  • 2021
    Tsinghua Academic Excellence Scholarship
    Tsinghua University
  • 2020
    First Prize in Tsinghua Intelligent UAV Challenge Competition
    Tsinghua University
  • 2019
    First Prize in Physics Competition for Undergraduates (Non-Physics Major)

Academic Service

  • Reviewer

    NeurIPS 2024, AISTATS (2025, 2026), ICLR (2025, 2026), ICCV 2025, ICML 2026